2011,Expected,Record,Year,for, technology 2011 Is Expected to Be A Record Year for Fab Equipment Spend
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According to Semis latest report on semiconductor equipmentspending and manufacturing capacity, it said that in 2011, there are an increasingcapital expenditure and a growing installed semiconductor manufacturingcapacity while Fab construction spending, decelerates this year and in 2012. Semis database tracks spending, capacity and technology node projectsfor every fab worldwide by company. Spending covers new and used equipment forproduction, pilot, and R&D fabs, including investments for LED devicefabrication. 2011 is expected to be a record year for fab equipmentspending. Since February, some companies have increased capex guidance and, asa result, fab equipment spending should reach an all-time high of about $44billion. The spending pace is expected to decline 6% to $41 billion in 2012,yet will remain the second highest annual level on record. said ChristianGregor Dieseldorff, senior analyst of fab information in the SEMI IndustryResearch and Statistics group. However, the number of new volume fabsstarting construction is historically low, with potential implications forindustry capacity plans in 2012 and beyond. SEMIs database indicates that 17 new volume fabs(including 13 LED fabs) have a high probability (>60%) of beginningconstruction this year. Excluding the LED fabs, SEMI predicts only four volume fabswill begin construction this year and another four in 2012. The SEMI fabdatabase also now identifies candidates for investment in the potentialtransition to manufacturing on 450 mm wafers. Sometime in 2012, the industrywill likely see initial equipment expenditures for 450mm pilot development.Construction of the first 450 mm ready facilities began last year, and morewill begin construction this year. Overall fab construction spending slows thisyear and in 2012. The earthquake in Japan on March 11 may have someshort-term effect on utilization rates and capacity output, but will not have asignificant impact on installed capacity. Recent Fab Capacity (withoutDiscretes) growth seems to be leveling off to below 10% growth annually. Installed capacity is expected to increase about 9% in2011 and 7% in 2011. In 2010, the growth rate in capacity of Foundry fabssurpassed Memory fabs, and this trend is expected to continue in 2011, asFoundry capacity will increase by 13% while Memory capacity will increase by8%. Growth of LED dedicated fab capacity remains in the double-digits with over40% estimated in 2011, though lower capacity growth is forecasted in 2012.Memory dominates the worldwide installed fab capacity with a 38% share of thecapacity this year, followed by foundries with about a 29% share. More spending indicates larger demand from the markets,we believe that there are many chances in 2011 and 2012, however, we have tonotice that more expanding also means much harder and complicated competitionsituation in this semiconductor field. Article source: http://www.hqew.net/events/news-article/225.html
2011,Expected,Record,Year,for,